Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE36890 | Gradient chuck method for wafer bonding employing a convex pressure | Frank T. Secco d'Aragona | 2000-10-03 |
| 6113721 | Method of bonding a semiconductor wafer | Frank T. Secco d'Aragona, David D. Oliver | 2000-09-05 |
| 5413952 | Direct wafer bonded structure method of making | Irenee Pages, Francesco D'Aragona, James Sellers | 1995-05-09 |
| 5389579 | Method for single sided polishing of a semiconductor wafer | — | 1995-02-14 |
| 5314107 | Automated method for joining wafers | Frank S. d'Aragona, Sherry L. F. Helsel | 1994-05-24 |
| 5268326 | Method of making dielectric and conductive isolated island | Israel A. Lesk, Frank S. d'Aragona, Francine Y. Robb | 1993-12-07 |
| 5131968 | Gradient chuck method for wafer bonding employing a convex pressure | Frank S. d'Aragona | 1992-07-21 |
| 4655191 | Wire saw machine | Thomas J. Hatfield | 1987-04-07 |
| 4494523 | Wire saw | — | 1985-01-22 |