Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE36890 | Gradient chuck method for wafer bonding employing a convex pressure | Raymond C. Wells | 2000-10-03 |
| 6113721 | Method of bonding a semiconductor wafer | David D. Oliver, Raymond C. Wells | 2000-09-05 |
| 5567649 | Method of forming a conductive diffusion barrier | Israel A. Lesk, Francine Y. Robb, Lewis E. Terry | 1996-10-22 |