Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5323051 | Semiconductor wafer level package | Victor J. Adams, Paul T. Bennett, Henry G. Hughes, Marilyn J. Stuckey | 1994-06-21 |
| 5164328 | Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip | William C. Dunn | 1992-11-17 |