Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600750 | Interconnect structures for preventing solder bridging, and associated systems and methods | Kyle S. Mayer | 2020-03-24 |
| 10580720 | Silicon interposer with fuse-selectable routing array | Bret K. Street, Eiichi Nakano | 2020-03-03 |
| 10566686 | Stacked memory package incorporating millimeter wave antenna in die stack | John F. Kaeding | 2020-02-18 |
| 10529592 | Semiconductor device assembly with pillar array | Akshay N. Singh, Kyle K. Kirby | 2020-01-07 |
| 10424553 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Sameer S. Vadhavkar | 2019-09-24 |
| 10418330 | Semiconductor devices and methods of making semiconductor devices | Steven R. Smith | 2019-09-17 |
| 10381297 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2019-08-13 |
| 10381336 | Proximity coupling interconnect packaging systems and methods | Rich Fogal | 2019-08-13 |
| 10297561 | Interconnect structures for preventing solder bridging, and associated systems and methods | Kyle S. Mayer | 2019-05-21 |
| 10134647 | Methods for forming interconnect assemblies with probed bond pads | Kyle K. Kirby, Luke England, Jaspreet S. Gandhi | 2018-11-20 |
| 10062678 | Proximity coupling of interconnect packaging systems and methods | Rich Fogal | 2018-08-28 |
| 10032703 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2018-07-24 |
| 9646899 | Interconnect assemblies with probed bond pads | Kyle K. Kirby, Luke England, Jaspreet S. Gandhi | 2017-05-09 |
| 9601374 | Semiconductor die assembly | Liana Foster | 2017-03-21 |
| 9595513 | Proximity coupling of interconnect packaging systems and methods | Rich Fogal | 2017-03-14 |
| 9418926 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2016-08-16 |
| 9165888 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Warren M. Farnworth, David R. Hembree | 2015-10-20 |
| 9129869 | Pillar on pad interconnect structures, semiconductor devices including same and related methods | Luke England, Christopher J. Gambee | 2015-09-08 |
| 8680654 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Warren M. Farnworth, David R. Hembree | 2014-03-25 |
| 8659153 | Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods | Luke England, Christopher J. Gambee | 2014-02-25 |
| 8492242 | Dry flux bonding device and method | Xiao Li, Josh D. Woodland, Shijian Luo, Jaspreet S. Gandhi, Te-Sung Wu | 2013-07-23 |
| 8435836 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Warren M. Farnworth, David R. Hembree | 2013-05-07 |
| 7872332 | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods | Warren M. Farnworth, David R. Hembree | 2011-01-18 |
| 7595226 | Method of packaging an integrated circuit die | William H. Lytle, Jianwen Xu | 2009-09-29 |
| 7579219 | Semiconductor device with a protected active die region and method therefor | George R. Leal, Robert J. Wenzel | 2009-08-25 |