Issued Patents All Time
Showing 26–50 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824010 | Interposers for microelectronic devices | Chan H. Yoo | 2023-11-21 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Eiichi Nakano | 2023-10-17 |
| 11791252 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2023-10-17 |
| 11735549 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2023-08-22 |
| 11710888 | Millimeter wave antenna and EMI shielding integrated with fan-out package | — | 2023-07-25 |
| 11664291 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Chan H. Yoo | 2023-05-30 |
| 11652283 | Integrated antenna using through silicon vias | — | 2023-05-16 |
| 11631644 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2023-04-18 |
| 11588233 | Tunable integrated millimeter wave antenna using laser ablation and/or fuses | John F. Kaeding | 2023-02-21 |
| 11587912 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2023-02-21 |
| 11574820 | Semiconductor devices with flexible reinforcement structure | Chan H. Yoo | 2023-02-07 |
| 11552045 | Semiconductor assemblies with redistribution structures for die stack signal routing | Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway | 2023-01-10 |
| 11482504 | Edge-notched substrate packaging and associated systems and methods | Madison E. Wale, James L. Voelz, Dylan W. Southern | 2022-10-25 |
| 11476241 | Interposer, microelectronic device assembly including same and methods of fabrication | Chan H. Yoo | 2022-10-18 |
| 11462472 | Low cost three-dimensional stacking semiconductor assemblies | Chan H. Yoo | 2022-10-04 |
| 11456284 | Microelectronic device assemblies and packages and related methods | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim | 2022-09-27 |
| 11444067 | Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems | Chan H. Yoo | 2022-09-13 |
| 11410981 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2022-08-09 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo, Bret K. Street +2 more | 2022-08-09 |
| 11398465 | Proximity coupling interconnect packaging systems and methods | Rich Fogal | 2022-07-26 |
| 11393794 | Microelectronic device assemblies and packages including surface mount components | Randon K. Richards, Aparna U. Limaye, Dong Soon Lim | 2022-07-19 |
| 11393791 | Three-dimensional stacking semiconductor assemblies with near zero bond line thickness | — | 2022-07-19 |
| 11386004 | Memory device interface and method | Brent Keeth, Chan H. Yoo, Roy Greeff, Matthew B. Leslie | 2022-07-12 |
| 11362070 | Microelectronic device assemblies and packages including multiple device stacks and related methods | Aparna U. Limaye, Dong Soon Lim, Randon K. Richards | 2022-06-14 |
| 11309285 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Chan H. Yoo, Mark E. Tuttle | 2022-04-19 |