Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394750 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, James L. Voelz, Dustin L. Holloway | 2025-08-19 |
| 11990446 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, James L. Voelz, Dustin L. Holloway | 2024-05-21 |
| 11848299 | Edge-notched substrate packaging and associated systems and methods | Owen R. Fay, Madison E. Wale, James L. Voelz | 2023-12-19 |
| 11552045 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, James L. Voelz, Dustin L. Holloway | 2023-01-10 |
| 11482504 | Edge-notched substrate packaging and associated systems and methods | Owen R. Fay, Madison E. Wale, James L. Voelz | 2022-10-25 |