Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Benjamin L. McClain, Zhaohui Ma | 2023-06-06 |
| 11594432 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2023-02-28 |
| 10998208 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2021-05-04 |
| 10879195 | Method for substrate moisture NCF voiding elimination | Brandon P. Wirz, Benjamin L. McClain | 2020-12-29 |
| 10700038 | Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool | Benjamin L. McClain | 2020-06-30 |
| 10410891 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2019-09-10 |
| 10276539 | Method for 3D ink jet TCB interconnect control | Brandon P. Wirz, Benjamin L. McClain, C. Alexander Ernst | 2019-04-30 |
| 10090177 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2018-10-02 |
| 10043688 | Method for mount tape die release system for thin die ejection | Brandon P. Wirz, Bret K. Street, James M. Derderian | 2018-08-07 |
| 7491570 | Die package having an adhesive flow restriction area | Bret K. Street, James M. Derderian | 2009-02-17 |
| 7476955 | Die package having an adhesive flow restriction area | Bret K. Street, James M. Derderian | 2009-01-13 |