| 11670612 |
Method for solder bridging elimination for bulk solder C2S interconnects |
Brandon P. Wirz, Benjamin L. McClain, Zhaohui Ma |
2023-06-06 |
| 11594432 |
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
Benjamin L. McClain, Travis M. Jensen |
2023-02-28 |
| 10998208 |
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
Benjamin L. McClain, Travis M. Jensen |
2021-05-04 |
| 10879195 |
Method for substrate moisture NCF voiding elimination |
Brandon P. Wirz, Benjamin L. McClain |
2020-12-29 |
| 10700038 |
Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing tool |
Benjamin L. McClain |
2020-06-30 |
| 10410891 |
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
Benjamin L. McClain, Travis M. Jensen |
2019-09-10 |
| 10276539 |
Method for 3D ink jet TCB interconnect control |
Brandon P. Wirz, Benjamin L. McClain, C. Alexander Ernst |
2019-04-30 |
| 10090177 |
Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
Benjamin L. McClain, Travis M. Jensen |
2018-10-02 |
| 10043688 |
Method for mount tape die release system for thin die ejection |
Brandon P. Wirz, Bret K. Street, James M. Derderian |
2018-08-07 |
| 7491570 |
Die package having an adhesive flow restriction area |
Bret K. Street, James M. Derderian |
2009-02-17 |
| 7476955 |
Die package having an adhesive flow restriction area |
Bret K. Street, James M. Derderian |
2009-01-13 |
