Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11589480 | Tubular heat spreaders for memory modules and memory modules incorporating the same | Thomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards | 2023-02-21 |
| 11581231 | Stress tuned stiffeners for micro electronics package warpage control | Mark E. Tuttle | 2023-02-14 |
| 11574820 | Semiconductor devices with flexible reinforcement structure | Owen R. Fay | 2023-02-07 |
| 11557526 | Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Hyunsuk Chun, Xiaopeng Qu | 2023-01-17 |
| 11508422 | Methods for memory power management and memory devices and systems employing the same | Eric J. Stave, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards +1 more | 2022-11-22 |
| 11476241 | Interposer, microelectronic device assembly including same and methods of fabrication | Owen R. Fay | 2022-10-18 |
| 11466838 | Multi-flexible display device having improved image discontinuity at panel boundary and method of manufacturing double-sided reflector therefor | Yongtaek Hong, Seung Hwan Lee, Hyung Soo Yoon, Byoung-Ho Lee, Dong-Yeon Kim | 2022-10-11 |
| 11462472 | Low cost three-dimensional stacking semiconductor assemblies | Owen R. Fay | 2022-10-04 |
| 11456286 | Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods | Todd O. Bolken | 2022-09-27 |
| 11444067 | Stacked interposer structures, microelectronic device assemblies including same, and methods of fabrication, and related electronic systems | Owen R. Fay | 2022-09-13 |
| 11416437 | Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities | Thomas H. Kinsley, George E. Pax, Timothy M. Hollis, Yogesh Sharma, Randon K. Richards +2 more | 2022-08-16 |
| 11410981 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Owen R. Fay | 2022-08-09 |
| 11410973 | Microelectronic device assemblies and packages and related methods and systems | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Bret K. Street +2 more | 2022-08-09 |
| 11386004 | Memory device interface and method | Brent Keeth, Owen R. Fay, Roy Greeff, Matthew B. Leslie | 2022-07-12 |
| 11309285 | Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same | Owen R. Fay, Mark E. Tuttle | 2022-04-19 |
| 11264332 | Interposers for microelectronic devices | Owen R. Fay | 2022-03-01 |
| 11239206 | Dual sided fan-out package having low warpage across all temperatures | Mark E. Tuttle | 2022-02-01 |
| 11206749 | Tubular heat spreaders for memory modules and memory modules incorporating the same | Thomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Randon K. Richards | 2021-12-21 |
| 11171118 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Owen R. Fay, Eiichi Nakano | 2021-11-09 |
| 11081565 | Memory modules and memory packages including graphene layers for thermal management | George E. Pax, Yogesh Sharma, Gregory A. King, Thomas H. Kinsley, Randon K. Richards | 2021-08-03 |
| 11037910 | Semiconductor device having laterally offset stacked semiconductor dies | Ashok Pachamuthu | 2021-06-15 |
| 10943860 | Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board | Eiichi Nakano | 2021-03-09 |
| 10872835 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Owen R. Fay | 2020-12-22 |
| 10861782 | Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods | Hyunsuk Chun, Tracy N. Tennant | 2020-12-08 |
| 10840229 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Owen R. Fay | 2020-11-17 |