Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032707 | Post-grind die backside power delivery | Min-Tih Lai, Tyler Leuten | 2018-07-24 |
| 9917041 | 3D chip assemblies using stacked leadframes | Cory A. Runyan | 2018-03-13 |
| 9646952 | Microelectronic package debug access ports | Bilal Khalaf, Saeed S. Shojaie | 2017-05-09 |