Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978434 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Boon Ping Koh | 2021-04-13 |
| 10964677 | Electronic packages with stacked sitffeners and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2021-03-30 |
| 10950552 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Paik Wen Ong | 2021-03-16 |
| 10948915 | Computer-assisted or autonomous driving vehicle incident management method and apparatus | Shekoufeh Qawami, Casey Baron, Naissa Conde, Mengjie Yu | 2021-03-16 |
| 10916524 | Stacked dice systems | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi | 2021-02-09 |
| 10651127 | Ring-in-ring configurable-capacitance stiffeners and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Paik Wen Ong | 2020-05-12 |
| 10606316 | Flexible computing device that includes a plurality of displays | Jackson Chung Peng Kong, Bok Eng Cheah, Eng Huat Goh | 2020-03-31 |
| 10580761 | Systems in packages including wide-band phased-array antennas and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Boon Ping Koh | 2020-03-03 |
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Shanggar Periaman | 2019-09-03 |
| 10394280 | Wearable electronic devices and components thereof | Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew +1 more | 2019-08-27 |
| 10396038 | Flexible packaging architecture | Bok Eng Cheah, Jackson Chung Peng Kong, Shanggar Periaman, Michael P. Skinner, Yen Hsiang Chew +2 more | 2019-08-27 |
| 10354957 | Electrical interconnect for a flexible electronic package | Bok Eng Cheah, Jackson Chung Peng Kong, Stephen H. Hall, Khang Choong Yong, Eric C Gantner | 2019-07-16 |
| 10014710 | Foldable fabric-based packaging solution | Bok Eng Cheah, Jackson Chung Peng Kong, Mark A. Schaecher, Teong Guan Yew, Eng Huat Goh | 2018-07-03 |
| 9904321 | Wearable electronic devices and components thereof | Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew +1 more | 2018-02-27 |
| 9812425 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Bok Eng Cheah, Shanggar Periaman, Jackson Chung Peng Kong | 2017-11-07 |
| 9778688 | Flexible system-in-package solutions for wearable devices | Jiamiao Tang, Junfeng Zhao, Michael P. Skinner, Yong She, Jiun Hann Sir +3 more | 2017-10-03 |
| 9721878 | High density second level interconnection for bumpless build up layer (BBUL) packaging technology | Bok Eng Cheah, Shanggar Periaman | 2017-08-01 |
| 9646953 | Integrated circuit packaging techniques and configurations for small form-factor or wearable devices | Jackson Chung Peng Kong, Bok Eng Cheah, Shanggar Periaman, Michael P. Skinner | 2017-05-09 |
| 9552995 | Electrical interconnect for an electronic package | Khang Choong Yong, Bok Eng Cheah, Teong Keat Beh, Howard L. Heck, Jackson Chung Peng Kong +1 more | 2017-01-24 |
| 9478524 | Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same | Bok Eng Cheah, Shanggar Periaman, Jackson Chung Peng Kong | 2016-10-25 |
| 9136251 | Method to enable controlled side chip interconnection for 3D integrated packaging system | Bok Eng Cheah, Shanggar Periaman, Jackson Chung Peng Kong | 2015-09-15 |
| 8987896 | High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same | Bok Eng Cheah, Shanggar Periaman | 2015-03-24 |
| 8697495 | Stacked die package | Bok Eng Cheah, Shanggar Periaman, Yen Hsiang Chew | 2014-04-15 |
| 8281229 | Firmware verification using system memory error check logic | Yen Hsiang Chew, Bok Eng Cheah, Shanggar Periaman | 2012-10-02 |
| 8198716 | Die backside wire bond technology for single or stacked die package | Shanggar Periaman, Bok Eng Cheah, Yen Hsiang Chew | 2012-06-12 |