Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282780 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-03-22 |
| 11227841 | Stiffener build-up layer package | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2022-01-18 |
| 11205622 | Stiffener shield for device integration | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-12-21 |
| 11195801 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-12-07 |
| 11158568 | Package with wall-side capacitors | Jenny Shio Yin Ong | 2021-10-26 |
| 11037874 | Plane-less voltage reference interconnects | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2021-06-15 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Min Suet Lim, Tin Poay Chuah, Howe Yin Loo | 2021-05-11 |
| 10985147 | Capacitors embedded in stiffeners for small form-factor and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Chin Lee Kuan | 2021-04-20 |
| 10978407 | Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same | Jackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Jenny Shio Yin Ong | 2021-04-13 |
| 10964677 | Electronic packages with stacked sitffeners and methods of assembling same | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-03-30 |
| 10910325 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2021-02-02 |
| 10903155 | Vertical modular stiffeners for stacked multi-device packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2021-01-26 |
| 10504854 | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same | Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2019-12-10 |
| 10396047 | Semiconductor package with package components disposed on a package substrate within a footprint of a die | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2019-08-27 |
| 10163777 | Interconnects for semiconductor packages | Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more | 2018-12-25 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh | 2018-05-15 |
| 9159714 | Package on wide I/O silicon | Jenny Shio Yin Ong, Choong Kooi Chee | 2015-10-13 |