Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9147627 | Flip chip MLP with conductive ink | Seung-yong Choi, Ti Ching Shian | 2015-09-29 |
| 8664752 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, David Chong, Tan Teik Keng +6 more | 2014-03-04 |
| 8513059 | Pre-molded clip structure | Erwin Victor Cruz | 2013-08-20 |
| 8183088 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Rajeev Joshi, Chung-Lin Wu +2 more | 2012-05-22 |
| 8106501 | Semiconductor die package including low stress configuration | Maria Clemens Y. Quinones | 2012-01-31 |
| 8008759 | Pre-molded clip structure | Erwin Victor Cruz | 2011-08-30 |
| 7972906 | Semiconductor die package including exposed connections | Erwin Victor Cruz | 2011-07-05 |
| 7838340 | Pre-molded clip structure | Erwin Victor Cruz | 2010-11-23 |
| 7768105 | Pre-molded clip structure | Erwin Victor Cruz | 2010-08-03 |
| 7638861 | Flip chip MLP with conductive ink | Seung-yong Choi, Ti Ching Shian | 2009-12-29 |
| 7315077 | Molded leadless package having a partially exposed lead frame pad | Yoon-hwa Choi, Shi-baek Nam, O-seob Jeon, Rajeev Joshi | 2008-01-01 |
| 7157799 | Semiconductor die package including carrier with mask and semiconductor die | Jonathan Almeria Noquil | 2007-01-02 |
| 7071033 | Method for forming semiconductor device including stacked dies | — | 2006-07-04 |
| 7052938 | Flip clip attach and copper clip attach on MOSFET device | Maria Clemens Y. Quinones | 2006-05-30 |
| 6870254 | Flip clip attach and copper clip attach on MOSFET device | Maria Clemens Y. Quinones | 2005-03-22 |
| 6867489 | Semiconductor die package processable at the wafer level | — | 2005-03-15 |
| 6861286 | Method for making power chip scale package | Ruben Madrid | 2005-03-01 |
| 6830959 | Semiconductor die package with semiconductor die having side electrical connection | — | 2004-12-14 |
| 6806580 | Multichip module including substrate with an array of interconnect structures | Rajeev Joshi | 2004-10-19 |
| 6777786 | Semiconductor device including stacked dies mounted on a leadframe | — | 2004-08-17 |
| 6649961 | Supporting gate contacts over source region on MOSFET devices | R. Evan Bendal | 2003-11-18 |
| 6646329 | Power chip scale package | Ruben Madrid | 2003-11-11 |
| 6645791 | Semiconductor die package including carrier with mask | Jonathan Almeria Noquil | 2003-11-11 |
| 6617655 | MOSFET device with multiple gate contacts offset from gate contact area and over source area | Margie Tumulak | 2003-09-09 |