Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159656 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2015-10-13 |
| 8912635 | Semiconductor device package and method of making a semiconductor device package | Chip King Tan | 2014-12-16 |
| 8664752 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2014-03-04 |
| 8183088 | Semiconductor die package and method for making the same | Oseob Jeon, Yoonhwa Choi, Maria Cristina Estacio, Rajeev Joshi, Chung-Lin Wu +2 more | 2012-05-22 |
| 8084299 | Semiconductor device package and method of making a semiconductor device package | Chip King Tan | 2011-12-27 |