Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478519 | Package including a semiconductor die and a capacitive component | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Oseob Jeon +2 more | 2016-10-25 |
| 9177925 | Apparatus related to an improved package including a semiconductor die | Ahmad Ashrafzadeh, Vijay Ullal, Justin Chiang, Daniel M. Kinzer, Oseob Jeon +2 more | 2015-11-03 |