Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11231386 | Compact microelectronic integrated gas sensor | Yonggang Jin, Suman Cherian | 2022-01-25 |
| 11222832 | Power semiconductor device package | Tiburcio A. Maldo, Keunhyuk LEE | 2022-01-11 |
| 11177203 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2021-11-16 |
| 11145571 | Heat transfer for power modules | Inpil Yoo, Seungwon IM, Dongwook Kang | 2021-10-12 |
| 11075137 | High power module package structures | Yusheng LIN | 2021-07-27 |
| 11004777 | Semiconductor device assemblies | Chung-Lin Wu, Bigildis Dosdos | 2021-05-11 |
| 10910297 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2021-02-02 |
| 10665525 | Heat transfer for power modules | Roveendra PAUL, Dukyong LEE | 2020-05-26 |
| 10553517 | High power module semiconductor package with multiple submodules | Jie Chang, Huibin Chen, Keunhyuk LEE | 2020-02-04 |
| 10546847 | Substrate interposer on a leadframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel N. Manatad, Chung-Lin Wu | 2020-01-28 |
| 10429509 | Molded proximity sensor | Jing-En Luan | 2019-10-01 |
| 10319670 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2019-06-11 |
| 10256178 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2019-04-09 |
| 10128207 | Semiconductor packages with pillar and bump structures | Yun Liu, Yonggang Jin | 2018-11-13 |
| 9851328 | Compact microelectronic integrated gas sensor | Yonggang Jin, Suman Cherian | 2017-12-26 |
| 9254596 | Top gate mold with particle trap | Glenn de los Reyes | 2016-02-09 |
| 9059058 | Image sensor device with IR filter and related methods | Yonggang Jin | 2015-06-16 |
| 8987871 | Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture | Glenn de los Reyes, Wee Chin Judy Lim | 2015-03-24 |
| 8860207 | Method of fabricating land grid array semiconductor package | Yonggang Jin, Romain Coffy | 2014-10-14 |
| 8664044 | Method of fabricating land grid array semiconductor package | Yonggang Jin, Romain Coffy | 2014-03-04 |
| 7358598 | Process for fabricating a semiconductor package and semiconductor package with leadframe | Jean-Luc Diot | 2008-04-15 |
| 7005322 | Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates | — | 2006-02-28 |
| 6885088 | Flat leadframe for a semiconductor package | Jean-Luc Diot, Christophe Prior, Jean-Pierre Moscicki | 2005-04-26 |