Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866218 | Wafer level MOSFET metallization | Daniel M. Kinzer, Steven Sapp, Chung-Lin Wu, Bigidis Dosdos | 2014-10-21 |
| 8664752 | Semiconductor die package and method for making the same | Yoonhwa Choi, Boon Huan Gooi, Maria Cristina Estacio, David Chong, Tan Teik Keng +6 more | 2014-03-04 |
| 8487371 | Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same | Daniel M. Kinzer, Steven Sapp, Chung-Lin Wu, Bigildis Dosdos | 2013-07-16 |
| 8193043 | High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same | Chung-Lin Wu, Eddy Tjhia, Bigildis Dosdos | 2012-06-05 |
| 8183088 | Semiconductor die package and method for making the same | Yoonhwa Choi, Boon Huan Gooi, Maria Cristina Estacio, Rajeev Joshi, Chung-Lin Wu +2 more | 2012-05-22 |
| 7800219 | High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same | Chung-Lin Wu, Eddy Tjhia, Bigildis Dosdos | 2010-09-21 |