Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105750 | Semiconductor device having a through-substrate via | Tyler Parent, Xuejun Ying | 2015-08-11 |
| 9099345 | Enhanced WLP for superior temp cycling, drop test and high current applications | Rey Alvarado, Tie Wang | 2015-08-04 |
| 9093333 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Duane Thomas Wilcoxen, Yi-Sheng Anthony Sun, Viren Khandekar | 2015-07-28 |
| 9087779 | Multi-die, high current wafer level package | Peter R. Harper, Viren Khandekar, Pirooz Parvarandeh | 2015-07-21 |
| 9087732 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Yong Li Xu, Viren Khandekar, Yi-Sheng Anthony Sun | 2015-07-21 |
| 8803068 | Light sensor having a contiguous IR suppression filter and a transparent substrate | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2014-08-12 |
| 8791404 | Light sensor having a transparent substrate, a contiguous IR suppression filter and through-substrate vias | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2014-07-29 |
| 8779540 | Light sensor having transparent substrate with lens formed therein | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2014-07-15 |
| 8749007 | Light sensor having transparent substrate and diffuser formed therein | Nicole D. Kerness, Zhihai Wang, Joy T. Jones | 2014-06-10 |
| 8748232 | Semiconductor device having a through-substrate via | Tyler Parent, Larry Wang | 2014-06-10 |
| 8742574 | Semiconductor device having a through-substrate via | Tyler Parent, Xuejun Ying | 2014-06-03 |
| 8692367 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Reynante Tamunan Alvarado | 2014-04-08 |
| 8686560 | Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress | Pirooz Parvarandeh, Reynante Tamunan Alvarado, Chiung C. Lo | 2014-04-01 |
| 8643150 | Wafer-level package device having solder bump assemblies that include an inner pillar structure | Yong Li Xu, Viren Khandekar, Yi-Sheng Anthony Sun | 2014-02-04 |
| 8586456 | Use of CL2 and/or HCL during silicon epitaxial film formation | Zhiyuan Ye, Yihwan Kim, Xiaowei Li, Ali Zojaji, Nicholas C. Dalida +2 more | 2013-11-19 |
| 8575493 | Integrated circuit device having extended under ball metallization | Yong Li Xu, Duane Thomas Wilcoxen, Yi-Sheng Anthony Sun, Viren Khandekar | 2013-11-05 |
| 8492284 | Low temperature etchant for treatment of silicon-containing surfaces | — | 2013-07-23 |
| 8445389 | Etchant treatment processes for substrate surfaces and chamber surfaces | Ali Zojaji | 2013-05-21 |
| 8405115 | Light sensor using wafer-level packaging | Albert Bergemont, Chiung C. Lo, Prashanth S. Holenarsipur, James Patrick Long | 2013-03-26 |
| 8278748 | Wafer-level packaged device having self-assembled resilient leads | Chiung C. Lo, Reynante Tamunan Alvarado | 2012-10-02 |
| 8264089 | Enhanced WLP for superior temp cycling, drop test and high current applications | Rey Alvarado, Tie Wang | 2012-09-11 |
| 8259464 | Wafer level package (WLP) device having bump assemblies including a barrier metal | Tiao Zhou | 2012-09-04 |
| 8093154 | Etchant treatment processes for substrate surfaces and chamber surfaces | Ali Zojaji | 2012-01-10 |
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Tiao Zhou, Viren Khandekar, Yong Li Xu | 2011-12-27 |
| 7960256 | Use of CL2 and/or HCL during silicon epitaxial film formation | Zhiyuan Ye, Yihwan Kim, Xiaowei Li, Ali Zojaji, Nicholas C. Dalida +2 more | 2011-06-14 |