RR

Richard Redburn

FI Flipchip International: 3 patents #5 of 18Top 30%
📍 Phoenix, AZ: #1,944 of 6,660 inventorsTop 30%
🗺 Arizona: #10,057 of 32,909 inventorsTop 35%
Overall (All Time): #1,542,468 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8446019 Solder bump interconnect Reynante Tamunan Alvarado, Yuan Lu 2013-05-21
8188606 Solder bump interconnect Reynante Tamunan Alvarado, Yuan Lu 2012-05-29
7973418 Solder bump interconnect for improved mechanical and thermo-mechanical performance Reynante Tamunan Alvarado, Yuan Lu 2011-07-05