| 12062596 |
Semiconductor die with stepped side surface |
Rongwei Zhang, Chien-Hao Wang |
2024-08-13 |
| 11791289 |
Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die |
ChienHao Wang, YuhHarng Chien |
2023-10-17 |
| 11302652 |
Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die |
ChienHao Wang, YuhHarng Chien |
2022-04-12 |
| 10910293 |
Leadframe with die pad having cantilevers to secure electronic component |
ChienHao Wang, YuhHarng Chien |
2021-02-02 |
| 9786582 |
Planar leadframe substrate having a downset below within a die area |
Chia-Yu Chang, Steven Su |
2017-10-10 |
| 6307248 |
Definition of anti-fuse cell for programmable gate array application |
Che-Chia Wei, Lap Chan, Poh Suan Tan |
2001-10-23 |
| 5952697 |
Multiple storage planes Read Only Memory integrated circuit device |
— |
1999-09-14 |
| 5923075 |
Definition of anti-fuse cell for programmable gate array application |
Che-Chia Wei, Lap Chan, Pom Suan Tan |
1999-07-13 |