Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062596 | Semiconductor die with stepped side surface | Rongwei Zhang, Chien-Hao Wang | 2024-08-13 |
| 11791289 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | ChienHao Wang, YuhHarng Chien | 2023-10-17 |
| 11302652 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | ChienHao Wang, YuhHarng Chien | 2022-04-12 |
| 10910293 | Leadframe with die pad having cantilevers to secure electronic component | ChienHao Wang, YuhHarng Chien | 2021-02-02 |
| 9786582 | Planar leadframe substrate having a downset below within a die area | Chia-Yu Chang, Steven Su | 2017-10-10 |
| 6307248 | Definition of anti-fuse cell for programmable gate array application | Che-Chia Wei, Lap Chan, Poh Suan Tan | 2001-10-23 |
| 5952697 | Multiple storage planes Read Only Memory integrated circuit device | — | 1999-09-14 |
| 5923075 | Definition of anti-fuse cell for programmable gate array application | Che-Chia Wei, Lap Chan, Pom Suan Tan | 1999-07-13 |