Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791289 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2023-10-17 |
| 11302652 | Semiconductor package substrate with a smooth groove about a perimeter of a semiconductor die | Bob Lee, YuhHarng Chien | 2022-04-12 |
| 10910293 | Leadframe with die pad having cantilevers to secure electronic component | Bob Lee, YuhHarng Chien | 2021-02-02 |