Issued Patents All Time
Showing 26–50 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11601065 | Power converter module | Vivek Kishorechand Arora, Makoto Shibuya, Kengo Aoya | 2023-03-07 |
| 11601182 | Method of transmitting and receiving data in wireless communication system supporting full-duplex radio and apparatus therefor | Yonghak Suh | 2023-03-07 |
| D979506 | Insulator | DongRak Jung, JiHwan Ryu | 2023-02-28 |
| 11530489 | Apparatus for electro-forming and apparatus for horizontal electro-forming | ByeongSun Yoo, Gotae Kim | 2022-12-20 |
| 11510074 | Method of transmitting and receiving data in wireless communication system supporting full-duplex radio and apparatus therefor | Yonghak Suh | 2022-11-22 |
| 11466378 | Electroplating apparatus and electroplating method using the same | Gotae Kim, ByeongSun Yoo, Byungchul Ahn, JuYoung Jeong, SangCheol Moon +2 more | 2022-10-11 |
| 11462588 | Organic light emitting display device having sub pixels of different areas and distances | Jung-Min Lee, Jungchul Kim | 2022-10-04 |
| 11417579 | Packaged semiconductor devices for high voltage with die edge protection | Vivek Kishorechand Arora, Anindya Poddar | 2022-08-16 |
| 11410875 | Fan-out electronic device | Hau Nguyen, Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +3 more | 2022-08-09 |
| 11387179 | IC package with half-bridge power module | Makoto Shibuya, Kengo Aoya, Vivek Kishorechand Arora | 2022-07-12 |
| 11329025 | Multi-chip package with reinforced isolation | Vivek Kishorechand Arora | 2022-05-10 |
| D949319 | Exhaust duct | DongRak Jung, ByeongPil Park | 2022-04-19 |
| 11302615 | Semiconductor package with isolated heat spreader | Anindya Poddar, Vivek Kishorechand Arora | 2022-04-12 |
| 11183441 | Stress buffer layer in embedded package | Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-11-23 |
| 11183460 | Embedded die packaging with integrated ceramic substrate | Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2021-11-23 |
| 11158567 | Package with stacked power stage and integrated control die | Vivek Kishorechand Arora, Benjamin A. Samples | 2021-10-26 |
| 11158595 | Embedded die package multichip module | Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2021-10-26 |
| 11075147 | Stacked die semiconductor package | Vivek Kishorechand Arora, Ken Pham | 2021-07-27 |
| 11031332 | Package panel processing with integrated ceramic isolation | Benjamin A. Samples, Vivek Kishorechand Arora | 2021-06-08 |
| 11032797 | Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals and method for receiving broadcast signals | Jaeho Hwang, Byounggill Kim, Jaehyung Kim, Sungryong Hong, Chulkyu Mun +4 more | 2021-06-08 |
| 10958378 | Method for communication apparatus processing an in-band emission interference signal when the communication apparatus operating in FDR mode tranceives signals using FDM manner | Dongkyu Kim, Sangrim Lee, Hojae Lee | 2021-03-23 |
| 10924314 | Broadcast signal transmission apparatus, broadcast signal reception apparatus, broadcast signal transmission method, and broadcast signal reception method | Jongseob Baek, Byounggill Kim, Jaehyung Kim, Woosuk KO, Sungryong Hong +5 more | 2021-02-16 |
| 10879155 | Electronic device with double-sided cooling | Anindya Poddar, Vivek Kishorechand Arora | 2020-12-29 |
| 10748827 | Packaged semiconductor devices for high voltage with die edge protection | Vivek Kishorechand Arora, Anindya Poddar | 2020-08-18 |
| 10637507 | Apparatus for transmitting broadcast signals, apparatus for receiving broadcast signals, method for transmitting broadcast signals and method for receiving broadcast signals | Jongseob Baek, Byounggill Kim, Jaehyung Kim, Sungryong Hong, Chulkyu Mun +4 more | 2020-04-28 |