Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Frame design in embedded die package

Frame design in embedded die package

US Patent 12154861 · Granted Nov 26, 2024

Estimated economic value: $43,726,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method of monitoring performance of an electronic device2025
Power module with multi-layer substrate and second insulation layer to increase 2025
Power module with multi-layer substrate and second insulation layer to increase 2025
Method and apparatus for transmitting and receiving data in wireless communicati2025
Thermoelectric conversion module2025
Packaged semiconductor device including heat slug2025
Packaged semiconductor device including heat slug2025
Interconnect structure for high power GaN module including a printed planar inte2025
Wireless communication system supporting full duplex radio, and apparatus theref2025
IC package with heat spreader2025
Conductive members atop semiconductor packages2025
Conductive members atop semiconductor packages2025