Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7612435 | Method of packaging integrated circuits | Jaime A. Bayan | 2009-11-03 |
| 7491625 | Gang flipping for IC packaging | Jaime A. Bayan, Nghia Thuc Tu, Ashok S. Prabhu | 2009-02-17 |
| 7385297 | Under-bond pad structures for integrated circuit devices | Vijaylaxmi Gumaste | 2008-06-10 |
| 7354802 | Thermal release wafer mount tape with B-stage adhesive | Chetan Paydenkar | 2008-04-08 |
| 7101620 | Thermal release wafer mount tape with B-stage adhesive | Chetan Paydenkar | 2006-09-05 |
| 7015587 | Stacked die package for semiconductor devices | — | 2006-03-21 |
| 6933597 | Spacer with passive components for use in multi-chip modules | Ashok S. Prabhu | 2005-08-23 |
| 6664615 | Method and apparatus for lead-frame based grid array IC packaging | Jaime A. Bayan | 2003-12-16 |
| 6607941 | Process and structure improvements to shellcase style packaging technology | Ashok S. Prabhu, Nikhil Kelkar | 2003-08-19 |
| 6603199 | Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages | — | 2003-08-05 |
| 6509635 | Integrated circuit package having offset die | — | 2003-01-21 |
| 6465890 | Integrated circuit package having offset segmentation of package power and/or ground planes and methods for reducing delamination in integrated circuit packages | Ka-Heng The | 2002-10-15 |
| 6278618 | Substrate strips for use in integrated circuit packaging | Shaw Wei Lee, Ram Veeraraghavan, Thanh Lequang | 2001-08-21 |