Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551859 | Chip scale and land grid array semiconductor packages | Shaw Wei Lee, Wayne Lee, Glenn Narvaez, William Jeffery Schaefer | 2003-04-22 |
| 6278618 | Substrate strips for use in integrated circuit packaging | Shaw Wei Lee, Anindya Poddar, Ram Veeraraghavan | 2001-08-21 |