Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7808089 | Leadframe having die attach pad with delamination and crack-arresting features | Luu Thanh Nguyen | 2010-10-05 |
| 7385297 | Under-bond pad structures for integrated circuit devices | Anindya Poddar | 2008-06-10 |