Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8344487 | Stress mitigation in packaged microchips | Xin Zhang, Michael Judy, Kevin Chau, Nelson Kuan, Timothy Spooner +1 more | 2013-01-01 |
| 7354802 | Thermal release wafer mount tape with B-stage adhesive | Anindya Poddar | 2008-04-08 |
| 7250310 | Process for forming and analyzing stacked die | Kevin Weaver | 2007-07-31 |
| 7101620 | Thermal release wafer mount tape with B-stage adhesive | Anindya Poddar | 2006-09-05 |