| 7848562 |
Method of reducing the time required to perform a passive voltage contrast test |
Steven Jacobson, Duc Huu Nguyen, William Ng, Zachary Joshua Gemmill, Usharani Bhimavarapu |
2010-12-07 |
| 7470553 |
Built-in design edit structures |
Zachary Joshua Gemmill |
2008-12-30 |
| 7352001 |
Method of editing a semiconductor die |
Henry Acedo, Lakshmi Durbha |
2008-04-01 |
| 7279343 |
De-packaging process for small outline transistor packages |
Hiep V. Nguyen, Henry Acedo |
2007-10-09 |
| 7250310 |
Process for forming and analyzing stacked die |
Chetan Paydenkar |
2007-07-31 |
| 7172977 |
Method for non-destructive removal of cured epoxy from wafer backside |
David Zakharian |
2007-02-06 |
| 7087927 |
Semiconductor die with an editing structure |
Henry Acedo, Lakshmi Durbha |
2006-08-08 |
| 6952106 |
E-beam voltage potential circuit performance library |
William Ng, Zachary Joshua Gemmill |
2005-10-04 |
| 6937351 |
Non-destructive method of measuring the thickness of a semiconductor wafer |
Zachary Joshua Gemmill, Steven Jacobson |
2005-08-30 |
| 6842021 |
System and method for detecting location of a defective electrical connection within an integrated circuit |
Gengying Gao |
2005-01-11 |
| 6801046 |
Method of testing the electrostatic discharge performance of an IC device |
Gengying Gao, Mohan Yegnashankaran, Hengyang (James) Lin |
2004-10-05 |
| 6518074 |
Backside IC device preparation process |
Hiep V. Nguyen, Henry Acedo, Smith J. Johnson |
2003-02-11 |
| 6424167 |
Vibration resistant test module for use with semiconductor device test apparatus |
Gengying Gao |
2002-07-23 |
| 6411111 |
Electron-electro-optical debug system E2ODS |
Geng Ying Gao |
2002-06-25 |
| 6117352 |
Removal of a heat spreader from an integrated circuit package to permit testing of the integrated circuit and other elements of the package |
Steve Scott |
2000-09-12 |
| 6100590 |
Low capacitance multilevel metal interconnect structure and method of manufacture |
Visvamohan Yegnashankaran, Hengyang James Lin |
2000-08-08 |
| 6083848 |
Removing solder from integrated circuits for failure analysis |
Emery Sugasawara, Jay Sherman Hidy |
2000-07-04 |
| 6068727 |
Apparatus and method for separating a stiffener member from a flip chip integrated circuit package substrate |
Zhaomin Ji |
2000-05-30 |
| 6043100 |
Chip on tape die reframe process |
Terry Lynne Barrette |
2000-03-28 |
| 5990543 |
Reframed chip-on-tape die |
Terry Lynne Barrette |
1999-11-23 |
