Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7410813 | Method of parallel lapping a semiconductor die | — | 2008-08-12 |
| 7112981 | Method of debugging a 3D packaged IC | — | 2006-09-26 |
| 6842021 | System and method for detecting location of a defective electrical connection within an integrated circuit | Kevin Weaver | 2005-01-11 |
| 6801046 | Method of testing the electrostatic discharge performance of an IC device | Mohan Yegnashankaran, Hengyang (James) Lin, Kevin Weaver | 2004-10-05 |
| 6424167 | Vibration resistant test module for use with semiconductor device test apparatus | Kevin Weaver | 2002-07-23 |