Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899794 | Optoelectronic package | Roozbeh Parsa, William French, Noboru Nakanishi | 2018-02-20 |
| 8857047 | Thin foil semiconductor package | Jaime A. Bayan, Nghia Thuc Tu, David Chin | 2014-10-14 |
| 8747640 | Foil plating for semiconductor packaging | Jaime A. Bayan, Nghia Thuc Tu | 2014-06-10 |
| 8450151 | Micro surface mount device packaging | Anindya Poddar, Tao Feng | 2013-05-28 |
| 8377267 | Foil plating for semiconductor packaging | Jaime A. Bayan, Nghia Thuc Tu | 2013-02-19 |
| 8375577 | Method of making foil based semiconductor package | Nghia Thuc Tu, Jaime A. Bayan, David Chin | 2013-02-19 |
| 8341828 | Thin foil semiconductor package | Jaime A. Bayan, Nghia Thuc Tu, David Chin | 2013-01-01 |
| 8298871 | Method and leadframe for packaging integrated circuits | Nghia Thuc Tu, Jaime A. Bayan | 2012-10-30 |
| 8101470 | Foil based semiconductor package | Anindya Poddar, Nghia Thuc Tu, Jaime A. Bayan, David Chin | 2012-01-24 |
| 7932152 | Method of forming a gate stack structure | Lap Chan, Alan Lek | 2011-04-26 |
| 7836586 | Thin foil semiconductor package | Jaime A. Bayan, Nghia Thuc Tu, David Chin | 2010-11-23 |