Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736042 | Delamination resistant device package having raised bond surface and mold locking aperture | Felix C. Li, Yee Kim Lee, Peng-Soon Lim, Lee Han Meng@Eugene Lee | 2014-05-27 |
| 8097934 | Delamination resistant device package having low moisture sensitivity | Felix C. Li, Yee Kim Lee, Peng-Soon Lim, Lee Han Meng@Eugene Lee | 2012-01-17 |
| 7838980 | TO263 device package having low moisture sensitivity | Yee Kim Lee, Peng-Soon Lim, Lee Han Meng@Eugene Lee | 2010-11-23 |
| 7763958 | Leadframe panel for power packages | Peng-Soon Lim, Sek Hoi Chong | 2010-07-27 |
| 7714418 | Leadframe panel | Peng-Soon Lim, Mohd Sabri Bin Mohamad Zin, Ken Pham | 2010-05-11 |
| 7582954 | Optical leadless leadframe package | Peng-Soon Lim, You Chye How, Sek Hoi Chong, Shee Min Yeong | 2009-09-01 |