Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030138 | Methods and systems of packaging integrated circuits | You Chye How, Shee Min Yeong, Peng-Soon Lim | 2011-10-04 |
| 7998791 | Panel level methods and systems for packaging integrated circuits with integrated heat sinks | Shee Min Yeong, Danny Cher Hau Koh, Eugene Wong | 2011-08-16 |
| 7763958 | Leadframe panel for power packages | Peng-Soon Lim, Terh Kuen Yii | 2010-07-27 |
| 7582954 | Optical leadless leadframe package | Peng-Soon Lim, Terh Kuen Yii, You Chye How, Shee Min Yeong | 2009-09-01 |
| 7271606 | Spring-based probe pin that allows kelvin testing | Tze Kang Tang, Chin Chai Gan, Hai Ching Tan | 2007-09-18 |
| 7102371 | Bilevel probe | Tze Kang Tang, Chin Chai Gan, Fuen Siang Ng | 2006-09-05 |