Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8847370 | Exposed die package that helps protect the exposed die from damage | Lee Han Meng@Eugene Lee, Kok Leong Yeo, Chen Seong CHUA | 2014-09-30 |
| 8647966 | Method and apparatus for dicing die attach film on a semiconductor wafer | Ken Fei Lim, You Chye How | 2014-02-11 |