Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12319563 | Semiconductor package with metal column mold barrier | James Raymond Maliclic Baello | 2025-06-03 |
| 12288763 | Flip chip package assembly having post connects with solder-based joints | — | 2025-04-29 |
| 12266631 | Flip-chip package assembly | John Carlo Cruz Molina, Steffany Ann Lacierda Moreno | 2025-04-01 |
| 12266624 | Semiconductor die with solder restraining wall | John Carlo Cruz Molina | 2025-04-01 |
| 12205871 | Conductive member cavities | Jovenic Romero Esquejo, Arvin Cedric Quiambao Mallari | 2025-01-21 |
| 12107062 | Semiconductor device with solder on pillar | — | 2024-10-01 |
| 12100678 | Conductive members for die attach in flip chip packages | Christopher Daniel Manack, Salvatore Frank Pavone, Maricel Fabia Escaño | 2024-09-24 |
| 12080667 | Conductive terminal for side facing packages | Jose Arvin Matute Plomantes | 2024-09-03 |
| 12009272 | Integral redistribution layer for WCSP | — | 2024-06-11 |
| 11929308 | Flip chip package assembly | Steffany Ann Lacierda Moreno, John Carlo Cruz Molina | 2024-03-12 |
| 11876065 | Flip chip package assembly | Katleen Fajardo Timbol, Salvatore Frank Pavone | 2024-01-16 |
| 11864471 | Semiconductor device with passivated magnetic concentrator | Dok Won Lee, Kashyap Mohan | 2024-01-02 |
| 11862576 | IC having electrically isolated warpage prevention structures | Christlyn Faith Hobrero Arias | 2024-01-02 |
| 11699639 | Conductive member cavities | Jovenic Romero Esquejo, Arvin Cedric Quiambao Mallari | 2023-07-11 |
| 11637083 | Flip-chip package assembly | John Carlo Cruz Molina, Steffany Ann Lacierda Moreno | 2023-04-25 |
| 11600583 | Textured bond pads | Aniceto Tabangcura Rabilas, Jr., Ray Fredric De Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya | 2023-03-07 |
| 11239190 | Solder-metal-solder stack for electronic interconnect | Maricel Fabia Escaño, Arvin Cedric Quiambao Mallari, Jovenic Romero Esquejo | 2022-02-01 |
| 11145612 | Methods for bump planarity control | — | 2021-10-12 |
| 11081456 | Textured bond pads | Aniceto Tabangcura Rabilas, Jr., Ray Fredric De Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya | 2021-08-03 |
| 10593640 | Flip chip integrated circuit packages with spacers | James Raymond Maliclic Baello | 2020-03-17 |