Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266631 | Flip-chip package assembly | Rafael Jose Lizares Guevara, John Carlo Cruz Molina | 2025-04-01 |
| 12132027 | Semiconductor device assembly with pre-reflowed solder | James Raymond Maliclic Baello, Jose Carlos Arroyo | 2024-10-29 |
| 11929308 | Flip chip package assembly | John Carlo Cruz Molina, Rafael Jose Lizares Guevara | 2024-03-12 |
| 11637083 | Flip-chip package assembly | Rafael Jose Lizares Guevara, John Carlo Cruz Molina | 2023-04-25 |
| 11600498 | Semiconductor package with flip chip solder joint capsules | James Raymond Maliclic Baello | 2023-03-07 |