Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387155 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Siva Prakash Gurrum | 2022-07-12 |
| 11380637 | Efficient redistribution layer topology | Vivek Swaminathan Sridharan, Joseph Liu | 2022-07-05 |
| 11362020 | Flipchip package with an IC having a covered cavity comprising metal posts | Jonathan Andrew Montoya, Jovenic Romero Esquejo, Salvatore Frank Pavone | 2022-06-14 |
| 11362047 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Rajen Manicon Murugan, Liang Wan, Hiep Xuan Nguyen | 2022-06-14 |
| 11127515 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Salvatore Frank Pavone | 2021-09-21 |
| 11121076 | Semiconductor die with conversion coating | Nazila Dadvand | 2021-09-14 |
| 11011488 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 |
| 11011483 | Nickel alloy for semiconductor packaging | Nazila Dadvand, Salvatore Frank Pavone | 2021-05-18 |
| 10840211 | Semiconductor package with leadframe having pre-singulated leads or lead terminals | Bradley Glasscock, Michael Todd Wyant | 2020-11-17 |
| 10833036 | Interconnect for electronic device | Patrick Francis Thompson, Stefan Herzer, Rakshit Agrawal | 2020-11-10 |
| 10796956 | Contact fabrication to mitigate undercut | Nazila Dadvand, Salvatore Frank Pavone | 2020-10-06 |
| 10734304 | Plating for thermal management | Nazila Dadvand, Salvatore Frank Pavone | 2020-08-04 |
| 10714417 | Semiconductor device with electroplated die attach | Nazila Dadvand | 2020-07-14 |
| 10692830 | Multilayers of nickel alloys as diffusion barrier layers | Nazila Dadvand, Salvatore Frank Pavone | 2020-06-23 |
| 10629334 | Nanostructure barrier for copper wire bonding | Nazila Dadvand, Salvatore Frank Pavone | 2020-04-21 |
| 10607931 | Semiconductor device with electroplated die attach | Nazila Dadvand | 2020-03-31 |
| 10566267 | Die attach surface copper layer with protective layer for microelectronic devices | Nazila Dadvand, Salvatore Frank Pavone | 2020-02-18 |
| 10453817 | Zinc-cobalt barrier for interface in solder bond applications | Nazila Dadvand, Salvatore Frank Pavone | 2019-10-22 |
| 10424552 | Alloy diffusion barrier layer | Nazila Dadvand, Salvatore Frank Pavone | 2019-09-24 |
| 9768130 | Integrated power package | Matthew David Romig | 2017-09-19 |
| 9321631 | Method for embedding controlled-cavity MEMS package in integration board | Frank Stepniak, Sreenivasan K. Koduri | 2016-04-26 |
| 8866237 | Methods for embedding controlled-cavity MEMS package in integration board | Frank Stepniak, Sreenivasan K. Koduri | 2014-10-21 |
| 7919842 | Structure and method for sealing cavity of micro-electro-mechanical device | Steven Kummerl | 2011-04-05 |