Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9911718 | ‘RDL-First’ packaged microelectronic device for a package-on-package device | Rajesh Katkar | 2018-03-06 |
| 9871019 | Flipped die stack assemblies with leadframe interconnects | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh | 2018-01-16 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Scott McGrath, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2017-11-07 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Reynaldo Co, Wael Zohni | 2017-09-12 |
| 9666513 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Rajesh Katkar, Sean MORAN | 2017-05-30 |
| 9490195 | Wafer-level flipped die stacks with leadframes or metal foil interconnects | Rajesh Katkar, Sean MORAN | 2016-11-08 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Wael Zohni, Willmar Subido | 2016-11-08 |
| 8679896 | DC/DC converter power module package incorporating a stacked controller and construction methodology | Rajeev Joshi, Jaime A. Bayan | 2014-03-25 |
| 8674418 | Method and apparatus for achieving galvanic isolation in package having integral isolation medium | Anindya Poddar, Vijaylaxmi Khanolkar, Peter Johnson | 2014-03-18 |
| 8283760 | Lead frame interconnect scheme with high power density | Ken Pham, Anindya Poddar | 2012-10-09 |
| 7795126 | Electrical die contact structure and fabrication method | Sadanand R. Patil, Shaw Wei Lee, Alexander H. Owens | 2010-09-14 |
| 7615407 | Methods and systems for packaging integrated circuits with integrated passive components | Anindya Poddar | 2009-11-10 |
| 7491625 | Gang flipping for IC packaging | Jaime A. Bayan, Nghia Thuc Tu, Anindya Poddar | 2009-02-17 |
| 7340181 | Electrical die contact structure and fabrication method | Sadanand R. Patil, Shaw Wei Lee, Alexander H. Owens | 2008-03-04 |
| 7259460 | Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package | Jamie A. BAYAN, Chan Peng Yeen, Hasfiza Ramley, Santhiran Nadarajah | 2007-08-21 |
| 7205095 | Apparatus and method for packaging image sensing semiconductor chips | Shaw Wei Lee | 2007-04-17 |
| 7186588 | Method of fabricating a micro-array integrated circuit package | Jaime A. Bayan, Santhiran Nadarajah, Chan Chee Ling, Hasfiza Ramley, Chan Peng Yeen | 2007-03-06 |
| 7102209 | Substrate for use in semiconductor manufacturing and method of making same | Jaime A. Bayan, Fred Drummond | 2006-09-05 |
| 7087986 | Solder pad configuration for use in a micro-array integrated circuit package | Jaime A. Bayan, Shaw Wei Lee | 2006-08-08 |
| 7067354 | Electrical die contact structure and fabrication method | — | 2006-06-27 |
| 7064419 | Die attach region for use in a micro-array integrated circuit package | Jaime A. Bayan, Chan Chee Ling, Lye Meng Kong, Santhiran Nadarajah | 2006-06-20 |
| 6933597 | Spacer with passive components for use in multi-chip modules | Anindya Poddar | 2005-08-23 |
| 6791072 | Method and apparatus for forming curved image sensor module | — | 2004-09-14 |
| 6781244 | Electrical die contact structure and fabrication method | — | 2004-08-24 |