Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607941 | Process and structure improvements to shellcase style packaging technology | Nikhil Kelkar, Anindya Poddar | 2003-08-19 |
| 6384397 | Low cost die sized module for imaging application having a lens housing assembly | Hem Takiar, Luu Thanh Nguyen | 2002-05-07 |
| 6364089 | Multi-station rotary die handling device | Inderjit Singh, Jaime A. Bayan, Hem Takiar | 2002-04-02 |
| 6352881 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Nikhil Kelkar, Christopher Quentin, Hem Takiar | 2002-03-05 |
| 6238949 | Method and apparatus for forming a plastic chip on chip package module | Luu Thanh Nguyen, Nikhil Kelkar, Hem Takiar | 2001-05-29 |