MY

Makoto Yoshino

Tdk: 29 patents #137 of 3,796Top 4%
TI Texas Instruments: 14 patents #973 of 12,488Top 8%
DE Denso: 10 patents #1,243 of 11,792Top 15%
PA Panasonic: 2 patents #9,678 of 21,108Top 50%
TI Tokai Rubber Industries: 2 patents #181 of 557Top 35%
HC Hitachi Koki Co.: 1 patents #557 of 888Top 65%
TI Toyota Industries: 1 patents #904 of 1,610Top 60%
NC Nippondenso Co.: 1 patents #1,765 of 3,479Top 55%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
GA Gac: 1 patents #3 of 16Top 20%
DA Denso Airs: 1 patents #9 of 13Top 70%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
Overall (All Time): #36,574 of 4,157,543Top 1%
62
Patents All Time

Issued Patents All Time

Showing 26–50 of 62 patents

Patent #TitleCo-InventorsDate
10763231 Bump bond structure for enhanced electromigration performance Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more 2020-09-01
10723616 Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more 2020-07-28
10665388 Method of manufacturing laminated coil component Yuya OSHIMA, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei TADAKI +3 more 2020-05-26
10340070 Multilayer common mode filter Takuo Abe 2019-07-02
10283409 Integrated clip and lead and method of making a circuit Makoto Shibuya 2019-05-07
10233074 Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more 2019-03-19
10115515 Multilayer common mode filter Yuma ISHIKAWA, Takuo Hattori 2018-10-30
9896330 Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more 2018-02-20
9673097 Integrated clip and lead and method of making a circuit Makoto Shibuya 2017-06-06
9667036 ESD protection component Yuma ISHIKAWA 2017-05-30
9293913 ESD protection component and method for manufacturing ESD protection component Hidenobu Umeda, Yuma ISHIKAWA, Keigo Higashida 2016-03-22
9255657 Pipe joint Masakazu Kondo 2016-02-09
9231907 Method for establishing connection between communication apparatuses, communication apparatus, and server apparatus Kazuki Sato, Kunio Gobara 2016-01-05
9185785 Electrostatic protection component Hidenobu Umeda, Takahiro Sato, Takuo Hattori, Shinichi Sato, Takeshi SHIBAYAMA 2015-11-10
8957744 Multilayer common mode filter Takuo Hattori 2015-02-17
8724284 Electrostatic protection component Hidenobu Umeda, Takahiro Sato, Takuo Hattori, Shinichi Sato, Takeshi SHIBAYAMA 2014-05-13
8466757 Multilayer common mode filter Takuo Hattori, Ryota Nakanishi 2013-06-18
8251101 Refrigerant piping unit and method of manufacturing pipe for the same Hiroki Naganawa, Naka Shibata, Masakazu Kondou 2012-08-28
8205667 Heat exchanger with connector 2012-06-26
8048358 Pop semiconductor device manufacturing method Kiyoharu Takano, Yoshimi Takahashi 2011-11-01
7837234 Pipe joint unit and method of manufacturing the same Kinji Ochiai, Koji Tanaka, Manabu Suzuki, Takeshi Hishikawa 2010-11-23
7810848 Pipe joint and pipe joint structure having the same and method of using the same 2010-10-12
7753413 Vapour-compression type refrigerating machine and double pipe structure and double pipe joint structure preferably used therefor Fumiaki Nakamura, Satoru Yamanashi, Shun Kurata, Takahisa Suzuki 2010-07-13
7611171 Piping joint device 2009-11-03
7544436 Fuel cell Seiji Hibino, Hiroaki Yoshida, Nawalage Cooray, Fumio Takei 2009-06-09