Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837775 | Microelectronic device package including antenna and semiconductor device | Yiqi Tang, Juan Alejandro Herbsommer | 2023-12-05 |
| 11784114 | Plated metal layer in power packages | Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Liang Wan | 2023-10-10 |
| 11784113 | Multilayer package substrate with stress buffer | Guangxu Li, Yiqi Tang | 2023-10-10 |
| 11621232 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Yiqi Tang, Liang Wan | 2023-04-04 |
| 11600932 | Antenna-on-package including multiple types of antenna | Yiqi Tang | 2023-03-07 |
| 11600555 | Package substrate having integrated passive device(s) between leads | Yiqi Tang | 2023-03-07 |
| 11600581 | Packaged electronic device and multilevel lead frame coupler | Juan Alejandro Herbsommer, Hassan Ali, Baher Haroun, Yigi Tang | 2023-03-07 |
| 11587891 | Ceramic semiconductor package seal rings | Yiqi Tang, Li Jiang | 2023-02-21 |
| 11557722 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Usman Mahmood Chaudhry +3 more | 2023-01-17 |
| 11545420 | High current packages with reduced solder layer count | Yiqi Tang, Liang Wan, William Todd Harrison, Manu J. Prakuzhy | 2023-01-03 |
| 11362047 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Liang Wan, Hiep Xuan Nguyen | 2022-06-14 |
| 10892405 | Hall-effect sensor package with added current path | Ming Li, Yiqi Tang, Jie Chen, Enis Tuncer, Usman Mahmood Chaudhry +3 more | 2021-01-12 |
| 10475786 | Packaged semiconductor device | Yiqi Tang, Makarand Ramkrishna Kulkarni | 2019-11-12 |
| 10262957 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2019-04-16 |
| 9941228 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2018-04-10 |
| 9666553 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2017-05-30 |
| 8369941 | High definition impedance imaging | Alvin Wexler, Patrick Adrian O'Connor, Zhong Zheng | 2013-02-05 |
| 7919860 | Semiconductor device having wafer level chip scale packaging substrate decoupling | Robert F. McCarthy, Baher Haroun, Peter R. Harper | 2011-04-05 |
| 6745070 | High definition electrical impedance tomography | Alvin Wexler, Zhen Mu, Guye Strobel | 2004-06-01 |