Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955895 | Structure and method for stacked wafer fabrication | Ku-Feng Yang, Wen-Chih Chiou, Weng-Jin Wu | 2011-06-07 |
| 7943421 | Component stacking using pre-formed adhesive films | Weng-Jin Wu, Ku-Feng Yang, Jung-Chih Hu, Wen-Chih Chiou | 2011-05-17 |
| 7812459 | Three-dimensional integrated circuits with protection layers | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu, Ku-Feng Yang | 2010-10-12 |
| 7466028 | Semiconductor contact structure | Chen-Hua Yu, Wen-Chih Chiou, Weng-Jin Wu | 2008-12-16 |
| 7354623 | Surface modification of a porous organic material through the use of a supercritical fluid | Ching-Ya Wang, Ping Chuang, Sunny Wu, Yu-Liang Lin, Mei Sheng Zhou +1 more | 2008-04-08 |