Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11626341 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2023-04-11 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Yu Chen, Wensen Hung | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2023-02-14 |
| 11527502 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2022-12-13 |
| 11515229 | Semiconductor package and manufacturing method thereof | Wei-Chih Lai, Chien-Chia Chiu, Chen-Hua Yu, Der-Chyang Yeh, Cheng-Hsien Hsieh +3 more | 2022-11-29 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11302600 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2022-04-12 |
| 11289398 | Package structure and manufacturing method thereof | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2022-03-29 |
| 11282825 | Package structure | Tsung-Yu Chen, Wensen Hung | 2022-03-22 |
| 11276656 | Integrated fan-out structure and method of forming | Hsien-Wei Chen, An-Jhih Su | 2022-03-15 |
| 11195802 | Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2021-12-07 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2021-09-28 |
| 11088048 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 11088079 | Package structure having line connected via portions | Chih-Kai Cheng, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2021-08-10 |
| 11069642 | Package structure and method of manufacturing the same | Hsuan-Ning Shih | 2021-07-20 |
| 11062971 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-13 |
| 11031352 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2021-06-08 |
| 11018073 | Heat spreading device and method | Wensen Hung, Hung-Chi Li, Tsung-Yu Chen | 2021-05-25 |
| 11011451 | Integrated circuit package and method | Yuan Sheng Chiu, Chih-Kai Cheng | 2021-05-18 |
| 10978373 | Semiconductor device methods of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Yu Chen, Wensen Hung | 2021-04-13 |
| 10930605 | Contact pad for semiconductor device | Chang-Chia Huang, Cheng-Chieh Hsieh, Wei-Cheng Wu | 2021-02-23 |
| 10879201 | Semiconductor package for wafer level packaging and manufacturing method thereof | Ming-Yen Chiu, Shou-Yi Wang | 2020-12-29 |
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2020-11-10 |