Issued Patents All Time
Showing 76–94 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613931 | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same | Hsien-Wei Chen, Cheng-Chieh Hsieh, Chang-Chia Huang | 2017-04-04 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu, Hsien-Wei Chen | 2017-01-24 |
| 9548283 | Package redistribution layer structure and method of forming same | Hung-Jui Kuo, Yi-Wen Wu | 2017-01-17 |
| 9449933 | Packaging device and method of making the same | Chang-Chia Huang, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Rung Su | 2016-09-20 |
| 9443806 | Chip packages and methods of manufacturing the same | Shin-Puu Jeng, Cheng-Chieh Hsieh, Chen-Hua Yu | 2016-09-13 |
| 9385091 | Reinforcement structure and method for controlling warpage of chip mounted on substrate | Chen-Hua Yu, Shang-Yun Hou, Cheng-Chieh Hsieh | 2016-07-05 |
| 9190359 | Scribe line structure for wafer dicing and method of making the same | Ping-Chang Wu | 2015-11-17 |
| 9053989 | Elongated bump structure in semiconductor device | Chen-Cheng Kuo, Chita Chuang, Chen-Shien Chen | 2015-06-09 |
| 8976529 | Lid design for reliability enhancement in flip chip package | Wen-Yi Lin, Po-Yao Lin, Kuo-Chin Chang, Shou-Yi Wang | 2015-03-10 |
| 8970033 | Extending metal traces in bump-on-trace structures | Yu-Feng Chen, Yuh Chern Shieh, Han-Ping Pu, Jiun Yi Wu, Tin-Hao Kuo | 2015-03-03 |
| 8927333 | Die carrier for package on package assembly | Yu-Ling Tsai, Han-Ping Pu | 2015-01-06 |
| 8922006 | Elongated bumps in integrated circuit devices | Yen-Liang Lin, Chen-Shien Chen, Tin-Hao Kuo, Sheng-Yu Wu, Chang-Chia Huang | 2014-12-30 |
| 8883628 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Chen-Cheng Kuo, Chen-Shien Chen | 2014-11-11 |
| 8836094 | Package device including an opening in a flexible substrate and methods of forming the same | Cheng-Chieh Hsieh, Hung-An Teng, Sao-Ling Chiu, Shang-Yun Hou | 2014-09-16 |
| 8610252 | Scribe line structure for wafer dicing | Ping-Chang Wu | 2013-12-17 |
| 8519535 | Method and structure for controlling package warpage | Yuh Chern Shieh, Kuo-Chin Chang | 2013-08-27 |
| 8476759 | Electrical connection structure | Yao-Chun Chuang, Chang-Chia Huang, Chen-Cheng Kuo, Chen-Shien Chen | 2013-07-02 |
| 8013425 | Scribe line structure for wafer dicing and method of making the same | Ping-Chang Wu | 2011-09-06 |
| 7871860 | Method of semiconductor packaging | Han-Ping Pu, Chen-Shien Chen | 2011-01-18 |