Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222121 | Fiducial scheme adapted for stacked integrated circuits | Robert Patti, Chockalingam Ramasamy | 2012-07-17 |
| 8183127 | Method for bonding wafers to produce stacked integrated circuits | Robert Patti, Ramasamy Chockalingam | 2012-05-22 |
| 7898095 | Fiducial scheme adapted for stacked integrated circuits | Robert Patti, Chockalingam Ramasamy | 2011-03-01 |
| 7750488 | Method for bonding wafers to produce stacked integrated circuits | Robert Patti, Ramasamy Chockalingam | 2010-07-06 |
| 6566260 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2003-05-20 |
| 6531390 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2003-03-11 |
| 6489233 | Non-metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-12-03 |
| 6429122 | Non metallic barrier formations for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-08-06 |
| 6376353 | Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects | Mei Sheng Zhou, Simon Chooi | 2002-04-23 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2002-04-16 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Subhash Gupta, Mei Sheng Zhou, Simon Chooi | 2002-03-05 |
| 6284657 | Non-metallic barrier formation for copper damascene type interconnects | Simon Chooi, Subhash Gupta, Mei Sheng Zhou | 2001-09-04 |
| 6225202 | Selective etching of unreacted nickel after salicidation | Subhash Gupta, Mei Sheng Zhou, Simon Chooi | 2001-05-01 |