Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222121 | Fiducial scheme adapted for stacked integrated circuits | Robert Patti, Sangki Hong | 2012-07-17 |
| 7898095 | Fiducial scheme adapted for stacked integrated circuits | Robert Patti, Sangki Hong | 2011-03-01 |
| 6225221 | Method to deposit a copper seed layer for dual damascene interconnects | Paul Ho, Mei Sheng Zhou, Subhash Gupta | 2001-05-01 |