Issued Patents All Time
Showing 26–50 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6394114 | Method for stripping copper in damascene interconnects | Simon Chooi, Paul Ho, Mei Sheng Zhou | 2002-05-28 |
| 6391732 | Method to form self-aligned, L-shaped sidewall spacers | Yelehanka Ramachandramurthy, Vijai Kumar Chhagan | 2002-05-21 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Sudipto Ranendra Roy +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou +2 more | 2002-04-30 |
| 6380084 | Method to form high performance copper damascene interconnects by de-coupling via and metal line filling | Yeow Kheng Lim, Alex See, Cher Liang Cha, Wang Ling Goh, Man Siu Tse | 2002-04-30 |
| 6380087 | CMP process utilizing dummy plugs in damascene process | Mei Sheng Zhou, Ramasamy Chockalingam | 2002-04-30 |
| 6372636 | Composite silicon-metal nitride barrier to prevent formation of metal fluorides in copper damascene | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2002-04-16 |
| 6368958 | Method to deposit a cooper seed layer for dual damascence interconnects | Paul Ho, Mei Sheng Zhou, Simon Chooi | 2002-04-09 |
| 6365508 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy, Paul Ho, Xu Yi +2 more | 2002-04-02 |
| 6365320 | Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography | David K. Foote | 2002-04-02 |
| 6358821 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Simon Chooi, Sudipto Ranendra Roy, Paul Ho, Xu Yi, Yakub Aliyu +2 more | 2002-03-19 |
| 6352917 | Reversed damascene process for multiple level metal interconnects | Mei Sheng Zhou, Simon Chooi, Sangki Hong | 2002-03-05 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-02-26 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Mei Sheng Zhou, Yi Xu | 2002-02-26 |
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Yi Xu, Simon Chooi, Mei Sheng Zhou | 2002-02-19 |
| 6346468 | Method for forming an L-shaped spacer using a disposable polysilicon spacer | Yelehanka Ramachandramurthy Pradeep, Vijai Chhagan | 2002-02-12 |
| 6340608 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2002-01-22 |
| 6331732 | Via structure in an integrated circuit utilizing a high conductivity metal interconnect and a method for manufacturing same | Susan H. Chen | 2001-12-18 |
| 6313018 | Process for fabricating semiconductor device including antireflective etch stop layer | Fei Wang, David K. Foote, Myron R. Cagan | 2001-11-06 |
| 6309982 | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Simon Chooi, Yi Xu, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2001-10-30 |
| 6284657 | Non-metallic barrier formation for copper damascene type interconnects | Simon Chooi, Mei Sheng Zhou, Sangki Hong | 2001-09-04 |
| 6274499 | Method to avoid copper contamination during copper etching and CMP | Paul Ho, Mei Sheng Zhou, Ramasamy Chockalingam | 2001-08-14 |
| 6261954 | Method to deposit a copper layer | Paul Ho, Mei Sheng Zhou, Simon Chooi | 2001-07-17 |
| 6261955 | Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes | Yakub Aliyu, Simon Chooi, Mei Sheng Zhou, John Sudijono, Sudipto Ranendra Roy +2 more | 2001-07-17 |
| 6255266 | Alkyldione peroxides as cleaning solutions for wafer fabs | Simon I, Mei Sheng Zhou, Paul Ho | 2001-07-03 |