Issued Patents All Time
Showing 51–60 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348407 | Method to improve adhesion of organic dielectrics in dual damascene interconnects | Subhash Gupta, Simon Chooi, Mei Sheng Zhou | 2002-02-19 |
| 6331479 | Method to prevent degradation of low dielectric constant material in copper damascene interconnects | Jianxun Li, Mei Sheng Zhou, Simon Chooi | 2001-12-18 |
| 6309982 | Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2001-10-30 |
| 6265321 | Air bridge process for forming air gaps | Simon Chooi, Mei Sheng Zhou | 2001-07-24 |
| 6261955 | Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes | Yakub Aliyu, Simon Chooi, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2001-07-17 |
| 6207554 | Gap filling process in integrated circuits using low dielectric constant materials | Jia Zhen Zheng, Jane Hui, Charles Lin, Yih-Shung Lin | 2001-03-27 |
| 6165891 | Damascene structure with reduced capacitance using a carbon nitride, boron nitride, or boron carbon nitride passivation layer, etch stop layer, and/or cap layer | Simon Chooi, Mei Sheng Zhou | 2000-12-26 |
| 6159759 | Method to form liquid crystal displays using a triple damascene technique | Kai Shao, Cerdin Lee, Shao-fu Sanford Chu | 2000-12-12 |
| 6124194 | Method of fabrication of anti-fuse integrated with dual damascene process | Kai Shao, Cerdin Lee, Shao-fu Sanford Chu | 2000-09-26 |
| 6117747 | Integration of MOM capacitor into dual damascene process | Kai Shao, Cerdin Lee, Shao-fu Sanford Chu | 2000-09-12 |