Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508339 | Blocker plate for use in a substrate process chamber | Xiaoxiong Yuan, Yu Lei, Kazuya Daito, Pingyan Lei, Dien-Yeh Wu +2 more | 2019-12-17 |
| 10170321 | Aluminum content control of TiAIN films | Wenyu Zhang, Wei V. Tang, Yixiong Yang, CHEN-HAN LIN, Yu Lei +8 more | 2019-01-01 |
| 9947578 | Methods for forming low-resistance contacts through integrated process flow systems | Yu Lei, Vikash Banthia, Kai Wu, Xinyu Fu, Kazuya Daito +9 more | 2018-04-17 |
| 7452808 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2008-11-18 |
| 6987321 | Copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subbash Gupta +2 more | 2006-01-17 |
| 6967162 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2005-11-22 |
| 6720204 | Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2004-04-13 |
| 6705512 | Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-03-16 |
| 6692579 | Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence | Sudipto Ranendra Roy, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2004-02-17 |
| 6690091 | Damascene structure with reduced capacitance using a boron carbon nitride passivation layer, etch stop layer, and/or cap layer | Simon Chooi, Mei Sheng Zhou | 2004-02-10 |
| 6683002 | Method to create a copper diffusion deterrent interface | Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono, Subhash Gupta +2 more | 2004-01-27 |
| 6627778 | Selective hydrogenation process for removing C10-C16 diolefins | Peicheng Wu, Yu Wang, Dong Liu, Zhengguo Ling, Xiaolei Huang | 2003-09-30 |
| 6569770 | Method for improving oxide erosion of tungsten CMP operations | Xian Bin Wang, Subramanian Balakumar, Cuiyang Wang | 2003-05-27 |
| 6475810 | Method of manufacturing embedded organic stop layer for dual damascene patterning | Mei Sheng Zhou, John Sudijono, Subhash Gupta, Sudipto Ranendra Roy, Paul Ho +2 more | 2002-11-05 |
| 6436824 | Low dielectric constant materials for copper damascene | Simon Chooi, Mei Sheng Zhou | 2002-08-20 |
| 6429117 | Method to create copper traps by modifying treatment on the dielectrics surface | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-08-06 |
| 6415973 | Method of application of copper solution in flip-chip, COB, and micrometal bonding | Kwok Keung Paul Ho, Simon Chooi, Mei Sheng Zhou, Yakub Aliyu, John Sudijono +2 more | 2002-07-09 |
| 6417088 | Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-07-09 |
| 6395631 | Low dielectric constant dielectric layer fabrication method employing hard mask layer delamination | Jian Xun Li | 2002-05-28 |
| 6391783 | Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique | John Sudijono, Yakub Aliyu, Mei Sheng Zhou, Simon Chooi, Subhash Gupta +2 more | 2002-05-21 |
| 6378759 | Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding | Kwok Keung Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-04-30 |
| 6358842 | Method to form damascene interconnects with sidewall passivation to protect organic dielectrics | Mei Sheng Zhou, Simon Chooi | 2002-03-19 |
| 6352921 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Licheng M. Han, Joseph Xie, Mei Sheng Zhou, Simon Chooi | 2002-03-05 |
| 6350689 | Method to remove copper contamination by using downstream oxygen and chelating agent plasma | Paul Ho, Simon Chooi, Yakub Aliyu, Mei Sheng Zhou, John Sudijono +2 more | 2002-02-26 |
| 6350675 | Integration of silicon-rich material in the self-aligned via approach of dual damascene interconnects | Simon Chooi, Mei Sheng Zhou, Subhash Gupta | 2002-02-26 |