Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236684 | Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer | Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Lipan Li, Li-Qun Xia +1 more | 2012-08-07 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Kang Sub Yim, Mehul Naik, Zhenjiang Cui +2 more | 2011-02-01 |
| 7851385 | Low temperature conformal oxide formation and applications | Matthew Spuller, Melody Agustin, Li-Qun Xia, Reza Arghavani | 2010-12-14 |
| 7723228 | Reduction of hillocks prior to dielectric barrier deposition in Cu damascene | Nagarajan Rajagopalan, Kegang Huang, Bok Hoen Kim, Hichem M'Saad, Thomas Nowak | 2010-05-25 |
| 7718548 | Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface | Sang-Mok Lee, Vladimir Zubkov, Zhenijiang Cui, Li-Qun Xia, Hichem M'Saad | 2010-05-18 |
| 7601651 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Li-Qun Xia, Hichem M'Saad | 2009-10-13 |
| 7371427 | Reduction of hillocks prior to dielectric barrier deposition in Cu damascene | Nagarajan Rajagopalan, Kegang Huang, Bok Hoen Kim, Hichem M'Saad, Thomas Nowak | 2008-05-13 |
| 7229911 | Adhesion improvement for low k dielectrics to conductive materials | Nagarajan Rajagopalan, Albert Lee, Annamalai Lakshmanan, Li-Qun Xia, Zhenjiang Cui | 2007-06-12 |
| 6656840 | Method for forming silicon containing layers on a substrate | Nagarajan Rajagopalan, Joe Feng, Christopher S. Ngai, Suketu Arun Parikh, Linh Thanh | 2003-12-02 |