| 12119223 |
Single precursor low-k film deposition and UV cure for advanced technology node |
Bo Xie, Ruitong Xiong, Kang Sub Yim, Yijun Liu, Li-Qun Xia |
2024-10-15 |
| 11621162 |
Systems and methods for forming UV-cured low-κ dielectric films |
Bo Xie, Ruitong Xiong, Kang Sub Yim, Yijun Liu, Li-Qun Xia |
2023-04-04 |
| 11600486 |
Systems and methods for depositing low-κdielectric films |
Bo Xie, Ruitong Xiong, Kang Sub Yim, Yijun Liu, Li-Qun Xia |
2023-03-07 |
| 11572622 |
Systems and methods for cleaning low-k deposition chambers |
Bo Xie, Ruitong Xiong, Kang Sub Yim, Yijun Liu, Li-Qun Xia |
2023-02-07 |
| 9391024 |
Multi-layer dielectric stack for plasma damage protection |
Bo Xie, Kang Sub Yim, Cheng Pan, Taewan Kim, Alexandros T. Demos |
2016-07-12 |
| 9324571 |
Post treatment for dielectric constant reduction with pore generation on low K dielectric films |
Kang Sub Yim, Pendar Ardalan, Alexandros T. Demos |
2016-04-26 |
| 9165998 |
Adhesion layer to minimize dielectric constant increase with good adhesion strength in a PECVD process |
Kang Sub Yim, Pendar Ardalan, Alexandros T. Demos |
2015-10-20 |
| 8349746 |
Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure |
Bo Xie, Alexandros T. Demos, Daemian Raj, Kang Sub Yim |
2013-01-08 |
