Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7998536 | Silicon precursors to make ultra low-K films of K<2.2 with high mechanical properties by plasma enhanced chemical vapor deposition | Alexandros T. Demos | 2011-08-16 |
| 7989033 | Silicon precursors to make ultra low-K films with high mechanical properties by plasma enhanced chemical vapor deposition | Alexandros T. Demos | 2011-08-02 |
| 7879683 | Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay | Amir Al-Bayati, Alexandros T. Demos, Mehul Naik, Zhenjiang Cui, Mihaela Balseanu +2 more | 2011-02-01 |
| 7745328 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee, Li-Qun Xia | 2010-06-29 |
| 7615482 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Daniel C. Edelstein, Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Steven E. Molis +3 more | 2009-11-10 |
| 7611996 | Multi-stage curing of low K nano-porous films | Francimar Schmitt, Yi Zheng, Sang-Hoon Ahn, Lester D'Cruz, Dustin W. Ho +4 more | 2009-11-03 |
| 7465659 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee, Li-Qun Xia | 2008-12-16 |
| 7422774 | Method for forming ultra low k films using electron beam | Yi Zheng, Srinivas D. Nemani, Li-Qun Xia, Eric Hollar | 2008-09-09 |
| 7422776 | Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD) | Lihua Huang, Francimar Schmitt, Li-Qun Xia | 2008-09-09 |
| 7399364 | Hermetic cap layers formed on low-κ films by plasma enhanced chemical vapor deposition | Vu Ngoc Tran Nguyen, Bok Hoen Kim | 2008-07-15 |
| 7297376 | Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers | Kelvin Chan, Nagarajan Rajagopalan, Josephine Ju-Hwei Chang Liu, Sang-Hoon Ahn, Yi Zheng +3 more | 2007-11-20 |
| 7285503 | Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition | Vu Ngoc Tran Nguyen, Bok Hoen Kim | 2007-10-23 |
| 7253123 | Method for producing gate stack sidewall spacers | Reza Arghavani, Michael Kwan, Li-Qun Xia | 2007-08-07 |
| 7157384 | Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD) | Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee, Li-Qun Xia | 2007-01-02 |
| 7060330 | Method for forming ultra low k films using electron beam | Yi Zheng, Srinivas D. Nemani, Li-Qun Xia, Eric Hollar | 2006-06-13 |
| 7056560 | Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) | Yi Zheng, Srinivas D. Nemani, Li-Qun Xia, Eric Hollar | 2006-06-06 |
| 7008484 | Method and apparatus for deposition of low dielectric constant materials | Soovo Sen, Dian Sugiarto, Peter Wai-Man Lee, Ellie Yieh | 2006-03-07 |
| 6984579 | Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication | Son V. Nguyen | 2006-01-10 |
| 6838393 | Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide | Melissa M. Tam, Dian Sugiarto, Chi-I Lang, Peter Wai-Man Lee, Li-Qun Xia | 2005-01-04 |